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TECHNICAL DATASHEET
ELECTRICALLY CONDUCTIVE DIE ATTACH ADHESIVE
DESCRIPTION ABLEBOND(R) 84-1LMISR4 electrically conductive die attach adhesive has been formulated for use in high throughput, automatic die attach equipment. The rheology of ABLEBOND 84-1LMISR4 adhesive allows minimum adhesive dispense and die put down dwell
ABLEBOND(R) 84-1LMISR4
times, without tailing or stringing problems. The unique combination of adhesive properties makes this material one the most widely used die attach materials in the semiconductor industry.
FEATURES * Excellent dispensability with minimal tailing and stringing * Box oven cure Test Method ATM-0018 ATM-0089 ATM-0067 ATM-0068 Test Description 10 x 10 mm Si die on glass slide Test Method ATM-0031
Typical Uncured Properties Filler Type Viscosity @ 25C Thixotropic Index Work Life @ 25C Storage Life @ -40C Cure Process Data Weight Loss on Cure Recommended Cure Condition Alternate Cure Condition
(1) (1)
ABLEBOND 84-1LMISR4 Silver 8000 cP 5.6 18 hours 1 year ABLEBOND 84-1LMISR4 5.3% 1 hour @ 175C
Test Description
Brookfield CP51 @ 5 rpm Viscosity @ 0.5/Viscosity @ 5 rpm Physical worklife by % filler
3 - 5C / min ramp to 175C + 1 hour @ 175C
The ramp was observed to yield reduced bondline voiding and increased strength
The above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary based on customers' experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures. PHYSIOCHEMICAL PROPERTIES - Post Cure Ionics Chloride Sodium Potassium ABLEBOND 84-1LMISR4 < 20 ppm < 10 ppm < 10 ppm 13 mhos/cm 6 0.35% Test Description Teflon flask, 5 gm sample/20-40 mesh, 50 gm DI water, 100C for 24 hours Conductometer pH meter Thermogravimetric analysis Test Method ATM-0007 ATM-0044 ATM-0002 ATM-0073
Water Extract Conductivity pH Weight Loss @ 300C
The figures shown above are typical values only. If you need to write a specification, please request our current Standard Release Specification. 07/05 Page 1 of 3
84-1LMISR4
PHYSIOCHEMICAL PROPERTIES - Post Cure Glass Transition Temperature Coefficient of Thermal Expansion ABLEBOND 84-1LMISR4 120C Below Tg Above Tg @ -65C Dynamic Tensile Modulus @ 25C @ 150C @ 250C Moisture Absorption @ Saturation THERMAL/ELECTRICAL PROPERTIES - Post Cure Thermal Conductivity @ 121C Volume Resistivity MECHANICAL PROPERTIES Post Cure Die Shear Strength @ 25C 0.6% ABLEBOND 84-1LMISR4 2.5 W/mK 0.0001 ohm-cm ABLEBOND 84-1LMISR4 19 kgf/die @25C Die Shear Strength (kgf/die) vs. Temperature 21 11 27 Die Shear Strength (kgf/die) after 85C/85% RH exposure for 168 hours @25C 12 10 23 @200C 2.9 2.6 2.4 @200C 1.8 2.5 1.8 Chip Size 7.6 mm (300 x 300 mil) 10.2 x 10.2 mm (400 x 400 mil) 12.7 x 12.7 mm (500 x 500 mil) Substrate Chip Warpage (m) vs. Post Cure Thermal Process(2) Post Cure
(1 min @ 250C)
Test Description TMA penetration mode
Test Method ATM-0058 ATM-0055
40 ppm/C 150 ppm/C
TMA expansion mode Dynamic mechanical thermal analysis using < 0.5mm thick sample
4400 MPa (640,000 psi) 3900 MPa (570,000 psi) 2000 MPa (290,000 psi) 300 MPa (44,000 psi)
ATM-0112
Dynamic vapor sorption after 85C/ 85% RH exposure Test Description C-MATIC conductance tester 4-point probe Test Description 2 x 2mm (80 x 80 mil) Si die on Ag/Cu leadframe @250C 1.7 1.4 2.0 Substrate Ag/Cu LF Bare Cu LF Pd/Ni/Cu LF 3 x 3 mm (120 x 120 mil) Si die
ATM-0093 Test Method ATM-0017 ATM-0020 Test Method ATM-0052
ATM-0052
Substrate Ag/Cu LF Bare Cu LF Pd/Ni/Cu LF
3 x 3 mm (120 x 120 mil) Si die
ATM-0052
Chip Warpage (m) @ 25C vs. Chip Size
Warpage 19 m 32 m 51 m Bare Cu LF 22 m 30 m 28 m
0.38mm (5 mil) thick Si die on 0.2mm thick Ag/Cu LF
ATM-0059
Ag/Cu LF 20 m 29 m 28 m
+ Wirebond
3 x 3 mm (120 x 120 mil) Si die
ATM-0059
+ Post Mold Bake
(4 hrs @ 175C)
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84-1LMISR4
APPLICATION GUIDELINES SHIPMENT This Ablestik product is packed and shipped in dry ice at -80C. Inside every dry ice shipment of Ablestik's products is a small packet containing the ABLECUBE. This is a small blue cube which retains its shape at -40C. If the ABLECUBE is exposed to temperatures higher than -40C, the cube will melt. Please check the state of the ABLECUBE to ensure the integrity of the shipment. If the ABLECUBE has melted upon Receiving inspection, place the entire shipment in a -40C freezer and contact your Ablestik Customer Service or Sales Representative. UNPACKING Transfer the syringes from the dry ice to a -40C freezer without ANY delays. Freeze-thaw voids will form in the syringes if the syringes are repeatedly thawed and refrozen. STORAGE This Ablestik product must be stored at -40C. If stored at these conditions, ABLEBOND 84-1LMISR4 adhesive may be usable for up to one (1) year. Alternate storage conditions may be used as follows: ADHESIVE APPLICATION Thawed adhesive should be immediately placed on dispense equipment for use. If the adhesive is transferred to a final dispensing reservoir, care must be exercised to avoid entrapment of contaminants and/or air into the adhesive. Adhesive must be completely used within the product's recommended work life of 18 hours. Silver-resin separation may occur if the adhesive is left out at ambient beyond the recommended work life. Apply enough adhesive to achieve a 25-50 m (1-2 mil) wet bondline thickness, dispensed with approximately 25% - 50% filleting on all sides of the die. Alternate dispense amounts may be used depending on the application requirements. Star or crossed shaped dispense patterns will yield fewer bondline voids than the matrix style of dispense pattern. Contact your Ablestik Technical Service Department for detailed recommendation on adhesive application, including dispensing. CURE This adhesive should be cured in conventional box oven per the recommended cure condition. Refer to the Cure Process Data section of the Technical Data Sheet for the recommended cure cycles. AVAILABILITY ABLEBOND(R) adhesives are packaged in syringes or jars per customer specification. Available package sizes range from 1cc to 30cc and 1 ounce to 1 pound. For details, refer to the Ablestik Standard Package Data Set or contact your Customer Service Representative.
Storage Temp 0C to +5C
* Jar rolling required
Syringes 8 days 2 months
Jars 1 month* 6 months"
-15C to -10C
The shelf life of the material is only valid when the material has been stored at the correct storage condition. Incorrect storage conditions will degrade the performance of the material in both handling (e.g. dispensing) and final cured properties. THAWING Allow the container to reach room temperature before use. After removing from the freezer, set the syringes to stand vertically while thawing. Refer to the Syringe Thaw Time chart for the thaw time recommendation. DO NOT open the container before contents reach ambient temperature. Any moisture that collects on the thawed container should be removed prior to opening the container. DO NOT re-freeze. Once thawed to room temperature, the adhesive should not be re-frozen.
CAUTION: This product may cause skin irritation in sensitive persons. Avoid skin contact. If contact does occur, wash area immediately with soap and water. Please refer to the Material Safety Data Sheet for more details.
20021 Susana Road, Rancho Dominguez, CA 90221 (310) 764-4600 Fax (310) 764-2545 Customer Service Fax (310) 764-1783
The information given and the recommendations made herein are believed to be accurate but no guarantee of their accuracy is made. In every case we recommend that purchasers before using any product conduct their own tests to determine whether the product is suitable for their particular purposes under their own operating conditions. No representative of ours has any authority to waive or change the foregoing provisions but, subject to such provisions, our engineers are available to assist purchasers in adapting our products to their needs. Nothing contained herein shall be construed to imply the nonexistence of any relevant patents or to constitute a permission, inducement or recommendation to practice any invention covered by any patent, without the authority from the owner of this patent. These materials are not designed or manufactured for implantation in the human body. Approval from FDA for such use as part of any product to be implanted in the human body has NOT been sought nor received. We also expect purchasers to use our products in accordance with the guiding principles of the American Chemistry Council's Responsible Care(R) program.
For a technical contact nearest you, visit www.ablestik.com
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